globe {{(header.eyebrow.langSelector.label != '') ? header.eyebrow.langSelector.label : 'Choose Language'}}
{{ popupData.primarybody }}
{{ distyMobilePopUpData.title }}
{{ distyMobilePopUpData.primarybody }}
{{ distyMobilePopUpData.secondarybody }}

Part List

{{addedBomQuantity}} {{addedBomName}} Added
{{totalQuantityInBom}} item(s) View List >>

Part List

  1. {{product.name}}

    {{product.description}}

    {{product.quantity}} item(s)
View List >>

 

Panduit Issued Two Patents for Fiber Optic Technology Innovation

 

TINLEY PARK, Ill. — (January 21, 2019) — Panduit Corp., a global leader of innovative electrical and network infrastructure solutions, announced today it has been issued two patents for its innovation in fiber optic technology. The patents are for a hybrid optical fiber and copper conductor cable assembly (patent No.10-215934) and a modular fiber optic tray (patent No.10-215944).

The first patent describes an innovative connector and cable assembly that house both optical fibers and copper conductors and was invented by Richard Pimpinella, Daniel Host, and Jose Castro. “Our industrial customers are increasingly connecting and networking their manufacturing assets, and hybrid optical and electrical communications systems will be a key technology enabler in the future,” says Richard Pimpinella, fellow optical research engineer.

The second patent discloses an innovative fiber optic tray for use within Panduit’s HD FlexTM fiber cabling system, that allow users to easily modify supporting rails to accommodate different sized fiber optic modules. The co-inventors of the modular fiber optic tray are Thomas Sedor, Jerry Wiltjer, Robert Reid, Joseph Sanders, Joel Kwasny, and Bon Sledzinski. “With the proliferation and coexistence of so many data rates within the data center, for example 10, 25, 40, 50 and 100 Gb/s, customers are demanding highly flexible and customizable cabling solutions to meet their needs.  This invention extends our class leading agility and will help customers retain their investment across data rate migrations,” explained Panduit’s Tom Walsh, vice president, data center.

The full-text for the hybrid optical fiber patent can be found here and the full-text for the modular fiber optic tray patent can be found here

About Panduit

Since 1955, Panduit’s culture of curiosity and passion for problem solving have enabled more meaningful connections between companies’ business goals and their marketplace success. Panduit creates leading-edge physical, electrical, network infrastructure and AV solutions for enterprise-wide environments, from the data center to the telecom room, from the desktop to the plant floor. Headquartered in Tinley Park, Ill., USA and operating in 112 global locations, Panduit’s proven reputation for quality and technology leadership, coupled with a robust partner ecosystem, help support, sustain, and empower business growth in a connected world.

 

 

Press Contact