Corning and Panduit Reach Agreement on Patent Proceedings

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Corning and Panduit Reach Agreement on Patent Proceedings Related to Data Center Products

TINLEY PARK, Ill. — (October 10, 2022) — Corning Optical Communications LLC, a subsidiary of Corning Incorporated (NYSE: GLW), and Panduit Corp. are entering into an agreement in the fiber optic data center products field. The agreement resolves pending patent infringement and related proceedings between the companies. The specific terms of the agreement are confidential.

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Since 1955, Panduit’s culture of curiosity and passion for problem solving have enabled more meaningful connections between companies’ business goals and their marketplace success. Panduit creates leading-edge physical, electrical, network infrastructure and AV solutions for enterprise-wide environments, from the data center to the telecom room, from the desktop to the plant floor. Headquartered in Tinley Park, Ill., USA and operating in 112 global locations, Panduit’s proven reputation for quality and technology leadership, coupled with a robust partner ecosystem, help support, sustain, and empower business growth in a connected world.

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