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The RGCBNJ660P22 Equipment Bonding Jumper Kit bonds the rack or cabinet to the subfloor or overhead building grounding system. Engineered to comply with US and International grounding requirements. HTAP is UL Listed and CSA Certified for applications up to 600 V when crimped with Panduit and specified competitor crimping tools, and Panduit crimping dies. Color Green/Yellow.

Specifications

Sub Brand StructuredGround™
Overall Length (In.) 60
Overall Length (mm) 1524
Angle 45°
Color Green/Yellow
Conductor Gauge (AWG) #6
Standards Met UL and CSA
Application Telecom/Data Center
Product Type Equipment Bonding Jumper Kit

Packaging Detail

UPC 07498379863
Std. Pkg. Qty. 1
Std. Pkg. Volume (cf) 0.0744
Std. Ctn. Qty. 10
Std. Ctn. Volume (cf) 0.7435

Resources

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If product info is not displayed in your selected language, it will be coming. We will continue to improve the experience over time.
Language
Specification Sheets StructuredGround™ Grounding Strips English
Specification Sheets StructuredGround™ Grounding Auxiliary Cable Brackets and Jumpers Spec Sheet English
Specification Sheets Soportes y Puentes de Unión para Cable Auxiliar de Puesta a Tierra StructuredGround Hoja de Especificaciones GRSP14--SA-SPA Spanish (Español)
Specification Sheets StructuredGround™ Grounding Kits for Net-Access™ Cabinets and 4-Post Racks GRSP16 English
Videos 5 Steps to Implementing a Grounding and Bonding System Video English
Part Drawings Part Drawing - DWG - RGCBNJ660P22_2D English
Part Drawings Part Drawing - DWG - RGCBNJ660P22_3D English
Part Drawings Common Bonding Network Jumper Kit English
Part Drawings Complete Installation Rack Kit Part Drawing C41678 English
Installation Documents StructuredGround Rack Grounding Kits Instruction Sheet T-PMPI-262-PC_07 English
Application Notes Telecommunications Bonding 5 Steps: D-GRFL03 AUS English
Articles Article - Product Related - 08Jan CBM B-G strategies for telco room English
Articles Article - Product Related - 06May CIM grounding and DC uptime English
Articles Observations on Supplemental Grounding and Bonding Systems English
Articles Article - Product Related - 08Jan TED (rev) minimize service interruptions with right connectors English
Articles Article - Product Related - 08Sep ECM (WBU part 3-4) supp singlepoint B-G systems English
Flyers Telecommunications Bonding 5 Steps: D-GRFL02 English
Flyers Tierras de Telecomunicaciones StructuredGround™ de Panduit Flyer GRFL02 Spanish (Español)
Selection Guides StructuredGround™ Kits for Data Center Cabinet Grounding: GRSG01--SA English
Selection Guides Shielded Copper Cabling Systems Selection Guide COSG28 English

Specifications

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Packaging Detail

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Resources

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