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Specifications

Sub Brand StructuredGround™
Material Copper
Overall Length (In.) 12
Overall Length (mm) 304.8
Overall Width (In.) 2
Overall Width (mm) 50.8
Overall Height (In.) 2.75
Overall Height (mm) 69.9
Stud Hole Size (In.) 0.44
Stud Hole Size (mm) 11.17
Finish/Coating Tin-Plated
Overall Thickness (In.) 0.25
Overall Thickness (mm) 6.4
Standards Met BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment
Application Telecom/Data Center
Product Type Grounding Busbar
Part Features Available with a variety of hole pattern spacing options, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation

Runtime Graph

Configuration

Packaging Detail

UPC 07498365927
Std. Pkg. Qty. 1
Std. Pkg. Volume (cf) 0.0036
Std. Ctn. Qty. 0
Std. Ctn. Volume (cf) 0.0000

Resources

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Specification Sheets StructuredGround Tele Rm Grounding and Bonding Kits for TIA-607-C Compliance English
Specification Sheets StructuredGround™ Grounding Auxiliary Cable Brackets and Jumpers Spec Sheet English
Specification Sheets StructuredGround™ Grounding Strips Spec Sheet GRSP17 English
Videos 5 Steps to Implementing a Grounding and Bonding System Video English
Part Drawings Grouding Busbar GB2B0306TPI-1 Part Drawing C41505 English
Application Notes Telecommunications Bonding 5 Steps: D-GRFL03 AUS English
Articles Article - Product Related - 08Jan CBM B-G strategies for telco room English
Articles Article - Product Related - 07Nov CIM B-G shielded system English
Articles Observations on Supplemental Grounding and Bonding Systems English
Articles Article - Product Related - 08Sep ECM (WBU part 3-4) supp singlepoint B-G systems English
Flyers Telecommunications Bonding 5 Steps: D-GRFL02 English
Flyers Tierras de Telecomunicaciones StructuredGround™ de Panduit Flyer GRFL02 Spanish (Español)
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