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StructuredGround™ GB2D0021TPI-1 Grounding Busbar
GB2D0021TPI-1
Specifications
| Sub Brand | StructuredGround™ |
| Material | Copper |
| Overall Width (In.) | 2 |
| Overall Width (mm) | 50.8 |
| Overall Height (In.) | 2.75 |
| Overall Height (mm) | 69.9 |
| Stud Hole Size (In.) | 0.44 |
| Stud Hole Size (mm) | 11.1 |
| Finish/Coating | Tin-Plated |
| Standards Met | cULus |
| Application | Telecom/Data Center |
| Product Type | Grounding Busbar |
| Part Features | Busbar has 1" hole D pattern spacing, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation |
Packaging Detail
| UPC | 07498312355 |
| Std. Pkg. Qty. | 1 |
| Std. Pkg. Volume (cf) | 0.0069 |
| Std. Ctn. Qty. | 0 |
| Std. Ctn. Volume (cf) | 0.0000 |
Resources
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Language
| Part Drawings | "D" Pattern Grounding Busbars Part Drawing N41743BB-DC | English | |
| Application Notes | Telecommunications Bonding 5 Steps: D-GRFL03 AUS | English | |
| Flyers | Telecommunications Bonding 5 Steps: D-GRFL02 | English | |
| Flyers | Tierras de Telecomunicaciones StructuredGround™ de Panduit Flyer GRFL02 | Spanish (Español) |
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Resources
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Language
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