Access floor grounding clamp for 1 3/4" round pedestals.
Sub Brand | StructuredGround™ |
Overall Width (In.) | 4 |
Overall Width (mm) | 101.6 |
Overall Height (In.) | 3.19 |
Overall Height (mm) | 81 |
Overall Depth (In.) | 5.19 |
Overall Depth (mm) | 131.8 |
Application | Utility/Ground Grid |
Standards Met | TIA-607-B |
Product Type | Pedestal Grounding Clamp |
Part Features | Designed to bond perpendicular MCBN conductors, Bonds to pedestal with a single bolt to simplify installation. |
UPC | 07498309853 |
Std. Pkg. Qty. | 1 |
Std. Pkg. Volume (cf) | 0.0416 |
Std. Ctn. Qty. | 10 |
Std. Ctn. Volume (cf) | 0.4157 |
Specification Sheets | Specification Sheet - SA-GRSP11 (Access Floor Grounding Clamp) WEB 7-15-11 | English | |
Specification Sheets | StructuredGround™ Grounding Strips | English | |
Specification Sheets | Tiras de Puesta a Tierra StructuredGround™ Hoja de Especificaciones GRSP02--SA-SPA | Spanish (Español) | |
Part Drawings | GPQC17-1/0 DWG | English | |
Part Drawings | GPQC17-1/0 DXF | English | |
Part Drawings | Grounding Pedestal Quad Clamps Part Drawing C41746_06 | English | |
Installation Documents | Structured Ground Access Floor Grounding Clamp Installation Instructions | English | |
Application Notes | Telecommunications Bonding 5 Steps: D-GRFL03 AUS | English | |
Flyers | Telecommunications Bonding 5 Steps: D-GRFL02 | English | |
Flyers | Tierras de Telecomunicaciones StructuredGround™ de Panduit Flyer GRFL02 | Spanish (Español) |