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StructuredGround™ GPQC10-1/0 Pedestal Grd Clamp, 1/0, PK1
GPQC10-1/0
The GPQC10-1/0 access floor grounding clamp is used to bond mesh common bonding network (MCBN) conductors to each other and bond the access flooor pedestals to the conductors. For 7/8" square and 1" - 1 1/8" round pedestals.
Specifications
| Sub Brand | StructuredGround™ |
| Compatible Pedestal Width (In.) | 7/8 Square: 1" Round: 1-1/8" Round |
| Clamp Material | Bronze |
| Maximum Compatible Conductor Size (AWG STR) | 1/0 |
| Minimum Compatible Conductor Size (AWG SOL) | 6 |
| Overall Depth (In.) | 4.19 |
| Overall Depth (mm) | 106.4 |
| Overall Width (In.) | 3.38 |
| Overall Width (mm) | 85.9 |
| Overall Height (In.) | 3.19 |
| Overall Height (mm) | 81 |
| Conductor Tightening Torque (in·lb) | 32 |
| Clamp Tightening Torque (in·lb) | 12.5 |
| Application | Utility/Ground Grid |
| Standards Met | TIA-607-B |
| Product Type | Ground Clamp |
| Part Features | Designed to bond perpendicular MCBN conductors, Bonds to pedestal with a single bolt to simplify installation. |
Packaging Detail
| UPC | 07498309846 |
| Std. Pkg. Qty. | 1 |
| Std. Pkg. Volume (cf) | 0.0234 |
| Std. Ctn. Qty. | 10 |
| Std. Ctn. Volume (cf) | 0.2342 |
Resources
NOTE: Not all resources are available in your language.
If product info is not displayed in your selected language, it will be coming. We will continue to improve the experience over time.
Language
| Specification Sheets | Specification Sheet - SA-GRSP11 (Access Floor Grounding Clamp) WEB 7-15-11 | English | |
| Specification Sheets | StructuredGround™ Grounding Strips | English | |
| Videos | 5 Steps to Implementing a Grounding and Bonding System Video | English | |
| Part Drawings | Part Drawing - PDF - C41746_05GPQC | English | |
| Part Drawings | GPQC10-1/0 DWG | English | |
| Part Drawings | GPQC10-1/0 DXF | English | |
| Installation Documents | Structured Ground Access Floor Grounding Clamp Installation Instructions | English | |
| Application Notes | Telecommunications Bonding 5 Steps: D-GRFL03 AUS | English | |
| Flyers | Telecommunications Bonding 5 Steps: D-GRFL02 | English | |
| Flyers | Tierras de Telecomunicaciones StructuredGround™ de Panduit Flyer GRFL02 | Spanish (Español) |
Specifications
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Packaging Detail
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Resources
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If product info is not displayed in your selected language, it will be coming. We will continue to improve the experience over time.
Language
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