The GCE250-1/0-Q E Style Ground Connector is designed to enhance the crimp process using technology that meets IEEE STD 837-2002 and REV 2014. Has a wide-range taking ability; multi-conductor design provides flexibility with minimum number of parts. Slotted design allows quick, easy assembly while the pre applied conductive antioxidant compound ensures a high quality mechanical and electrical bond. UL467 & CSA certified for grounding, bonding and suitable for direct burial in earth or concrete.
Sub Brand | StructuredGround™ |
Connector Type | E-Style Connector |
Material | Copper |
Material Properties | High Conductivity |
Overall Length (In.) | 1 |
Overall Length (mm) | 25.4 |
Overall Width (In.) | 1.05 |
Overall Width (mm) | 26.7 |
Overall Height (In.) | 2.18 |
Overall Height (mm) | 55.4 |
Maximum Copper Conductor Size (AWG SOL) | 6 |
Maximum Copper Conductor Size (AWG STR) | 4/0 |
Maximum Copper Conductor Size (kcmil) | 250 |
Minimum Copper Conductor Size (AWG SOL) | 6 |
Minimum Copper Conductor Size (AWG STR) | 6 |
Minimum Copper Conductor Size (kcmil) | 250 |
Maximum Ground Rod Size (In.) | 5/8 |
Maximum Ground Rod Size (mm) | 15.9 |
Minimum Ground Rod Size (In.) | 1/2 |
Minimum Ground Rod Size (mm) | 12.7 |
Maximum Rebar Size (AWG) | 4 |
Maximum Rebar Size (In.) | 1/2 |
Maximum Rebar Size (mm) | 12.7 |
Minimum Rebar Size (AWG) | 3 |
Minimum Rebar Size (In.) | 3/8 |
Minimum Rebar Size (mm) | 9.5 |
Panduit Die Index Number | PG25 |
Color Code | Black |
Standards Met | IEEE Std 837-2002 and REV 2014, CSA 22.2, cULus listed to UL467 for direct burial grounding applications |
Application | Utility/Ground Grid |
Product Type | E-Tap Grounding Connector |
UPC | 61305685451 |
Std. Pkg. Qty. | 25 |
Std. Pkg. Volume (cf) | 0.0917 |
Std. Ctn. Qty. | 0 |
Std. Ctn. Volume (cf) | 0.0000 |
Videos | Video 4:3 - Product - compression vs exothermic_WEB | English | |
Part Drawings | E-Tap Grounding Connectors Part Drawing N10652AK-DC | English | |
Installation Documents | Direct Burial Compression Connectors Installation Instructions T-PMPI-289-PC | English | |
White Papers | Physical Infrastructure Solutions for Grounding and Bonding GRAT02--SA-ENG | English |
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