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StructuredGround™ GB2B0304TPI-1 Telecom Grd Busbars, 0304, Copper, Tin-Plated
GB2B0304TPI-1
The GB2B0304TPI-1 Grounding Busbar meets BICSI and ANSI/TIA-607-D requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels to identify busbars.
Specifications
| Sub Brand | StructuredGround™ |
| Material | Copper |
| Overall Length (In.) | 10 |
| Overall Length (mm) | 254 |
| Overall Width (In.) | 2 |
| Overall Width (mm) | 50.8 |
| Overall Height (In.) | 2.75 |
| Overall Height (mm) | 69.9 |
| Stud Hole Size (In.) | 0.44 |
| Stud Hole Size (mm) | 11.17 |
| Finish/Coating | Tin-Plated |
| Overall Thickness (In.) | 0.25 |
| Overall Thickness (mm) | 6.4 |
| Standards Met | BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment |
| Application | Telecom/Data Center |
| Product Type | Grounding Busbar |
| Part Features | Available with a variety of hole pattern spacing options, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation |
Packaging Detail
| UPC | 07498365926 |
| Std. Pkg. Qty. | 1 |
| Std. Pkg. Volume (cf) | 0.0030 |
| Std. Ctn. Qty. | 0 |
| Std. Ctn. Volume (cf) | 0.0000 |
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