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StructuredGround™ GB4B0612TPI-1 Telecom Grd Busbars, 0612, Copper, Tin-Plated
GB4B0612TPI-1
The GB4B0612TPI-1 Grounding Busbar meets BICSI and ANSI/TIA-607-D requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels to identify busbars.
Specifications
| Sub Brand | StructuredGround™ |
| Material | Copper |
| Overall Length (In.) | 12 |
| Overall Length (mm) | 304.8 |
| Overall Width (In.) | 4 |
| Overall Width (mm) | 101.6 |
| Overall Height (In.) | 2.75 |
| Overall Height (mm) | 69.9 |
| Stud Hole Size (In.) | 0.44 |
| Stud Hole Size (mm) | 11.17 |
| Finish/Coating | Tin-Plated |
| Overall Thickness (In.) | 0.25 |
| Overall Thickness (mm) | 6.4 |
| Standards Met | BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment |
| Application | Telecom/Data Center |
| Product Type | Grounding Busbar |
| Part Features | Available with a variety of hole pattern spacing options, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation |
Packaging Detail
| UPC | 07498334540 |
| Std. Pkg. Qty. | 1 |
| Std. Pkg. Volume (cf) | 0.0069 |
| Std. Ctn. Qty. | 0 |
| Std. Ctn. Volume (cf) | 0.0000 |
Resources
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If product info is not displayed in your selected language, it will be coming. We will continue to improve the experience over time.
Language
| Videos | 5 Steps to Implementing a Grounding and Bonding System Video | English | |
| Part Drawings | Grouding Busbar GB4B0612TPI-1 Part Drawing C41502 | English | |
| Application Notes | Telecommunications Bonding 5 Steps: D-GRFL03 AUS | English | |
| Articles | Article - Product Related - 08Jan CBM B-G strategies for telco room | English | |
| Articles | Article - Product Related - 06May CIM grounding and DC uptime | English | |
| Articles | Article - Product Related - 07Jun BISCI B-G design issues | English | |
| Articles | Article - Product Related - 07Nov CIM B-G shielded system | English | |
| Articles | Observations on Supplemental Grounding and Bonding Systems | English | |
| Articles | Article - Product Related - 08Sep ECM (WBU part 3-4) supp singlepoint B-G systems | English | |
| Flyers | Telecommunications Bonding 5 Steps: D-GRFL02 | English | |
| Flyers | Tierras de Telecomunicaciones StructuredGround™ de Panduit Flyer GRFL02 | Spanish (Español) |
Specifications
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Packaging Detail
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Resources
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If product info is not displayed in your selected language, it will be coming. We will continue to improve the experience over time.
Language
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