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All Products Grounding & Bonding Grounding Busbars

StructuredGround™ GB4B0612TPI-1 Telecom Grd Busbars, 0612, Copper, Tin-Plated

GB4B0612TPI-1

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The GB4B0612TPI-1 Grounding Busbar meets BICSI and ANSI/TIA-607-D requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels to identify busbars.

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StructuredGround™ GB4B0612TPI-1 Telecom Grd Busbars, 0612, Copper, Tin-Plated

Specifications

Sub Brand StructuredGround™
Material Copper
Overall Length (In.) 12
Overall Length (mm) 304.8
Overall Width (In.) 4
Overall Width (mm) 101.6
Overall Height (In.) 2.75
Overall Height (mm) 69.9
Stud Hole Size (In.) 0.44
Stud Hole Size (mm) 11.17
Finish/Coating Tin-Plated
Overall Thickness (In.) 0.25
Overall Thickness (mm) 6.4
Standards Met BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment
Application Telecom/Data Center
Product Type Grounding Busbar
Part Features Available with a variety of hole pattern spacing options, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation

Packaging Detail

UPC 07498334540
Std. Pkg. Qty. 1
Std. Pkg. Volume (cf) 0.0069
Std. Ctn. Qty. 0
Std. Ctn. Volume (cf) 0.0000

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